QFN Socket 32P 0.5MM Pitch SMT

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Payment Type:

L/C,T/T,Paypal,Western Union

Incoterm:

FOB,CFR,CIF,EXW

Min. Order:

1000 Piece/Pieces

Transportation:

Ocean,Land,Air

Port:

Shenzhen

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Product Description

Product Attributes
Supply Ability & Additional Information
Packaging & Delivery

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Overview

Product Attributes

Model No.: 20170428-01-OQF

Brand: Antenk

Supply Ability & Additional Information

Packaging: carton

Productivity: 100000000pcs per month

Transportation: Ocean,Land,Air

Place of Origin: China

Supply Ability: 100000000pcs per month

Certificate: ISO 9001-2015

HS Code: 8536909000

Port: Shenzhen

Payment Type: L/C,T/T,Paypal,Western Union

Incoterm: FOB,CFR,CIF,EXW

Packaging & Delivery

Selling Units:: Piece/Pieces

Package Type:: carton

Manufacturer :ANTENK ELECTRONICS., CO. LTD.

High quality, competitive price, fast delivery, quick reply. UL, Rohs, Reach passed.

Enterprise slogan: a group of people, one heart, work together, will win
Corporate Mission: Connecting the World and Connecting the Future
Corporate Vision: Become the First Brand of Famous Connectors
Values: Diligence, Gratitude and Honesty
Product name:QFN Socket 32P 0.5MM Pitch SMT 20170428-01-OQF

NOTE:
A.MATERIAL:
1 INSULATOR:LCP E130I GLASS FILLED UL 94V-0
2 CONTACTS:PHOSPHOR COPPER C5210
3 UPPER COVER:STAINLESS STEEL SS316

B.ELECTRICAL CHARACTERISTICS;
1 CONTACTRESISTANCE:20mΩ MAXIMUM
2 CONTACT CURRENT RATING:0.1A MAX
3 DIELECTRIC WITHSTANDING VOLTAGE:250 VAC/MINUTE
4 INSULATION RESISTANCE 5000 MEGOHMS MIN
5 OPERATING TEMPEROTURE:-25°C ～ 85°C
6 RESISTANCE TO SOLDERING HEAT:280°MAXIMUM FOR
10 SECONDS MAXIMUM .

C.Contact Plating:
50 μin (1.27 μm) Ni and 3 μin (76 nm) Au
Packing:Tapa&Reel+CAP